Family: LATIBLEND
Base resin:Polyamide 6 (PA 6)
General information
Blend based on Polyamide 6 (PA 6) / Polypropylene homopolymer (PPh). Unfilled. PFAS-free product.
The products mentioned herein are not suitable for applications in contact with foodstuffs or for potable water transportation, or for toy manufacturing.
The products mentioned herein are not suitable for applications in the pharmaceutical, medical or dental sector.
Features
- - Toughened
Project challenges
- - Thermal conductivity
Additives
- - Unfilled
Process types
- - Injection moulding
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Technical datasheets
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Technical characteristics
| Physical properties | Standard | Value | Measure Units |
|---|---|---|---|
| Density | ISO 1183 | 1.05 | g/cm³ |
| Linear shrinkage at moulding | |||
| Longitudinal (2.0mm/60MPa) | ISO 294-4 | 1.00 ÷ 1.30 | % |
| Transversal (2.0mm/60MPa) | ISO 294-4 | 1.30 ÷ 1.60 | % |
| Dimensional stability | --- | 63 | |
| Moisture absorption | |||
| Saturation, in air | ISO 62-4 | 2.15 | % |
| Mechanical properties | Standard | Value | Measure Units |
| CHARPY impact strength | |||
| Notched, at +73°F | ISO 179-1eA | 4.7 | ft.lb/in² |
| Tensile elongation | |||
| At yield (5 mm/min), 73°F | ISO 527 | 10 | % |
| Tensile strength | |||
| At yield (5 mm/min), 73°F | ISO 527 | 6750 | psi |
| Elastic modulus | |||
| Tensile (1 mm/min), 73°F | ISO 527 | 345 | kpsi |
| Thermal properties | Standard | Value | Measure Units |
| Coefficient of linear thermal expansion (CLTE) | |||
| +30°C to +100°C (longitudinal) | ISO 11359 | 110 | × 10ˉ⁶ Kˉ¹ |
| +30°C a +100°C (transversal) | ISO 11359 | 110 | × 10ˉ⁶ Kˉ¹ |
| VICAT - Softening point | |||
| 50N (heating rate 120°C/h) | ISO 306 | 302 | °F |
| HDT - Heat Deflection Temperature | |||
| 0.45 MPa | ISO 75 | 230 | °F |
| 1.81 MPa | ISO 75 | 122 | °F |
| Thermal conductivity | |||
| in plane | ASTM E 1461-92 | 1.3 | W/mK |
| through plane | ASTM E 1461-92 | 1.3 | W/mK |
| Electrical properties | Standard | Value | Measure Units |
| Electrical resistivity | |||
| Surface, dry | ASTM D 257 / D 4496 | 1E12 | ohm |
| Dielectric strength (short period) | |||
| 2 mm thickness, 23°C, dry | ASTM D 149 | 508 | V/mil |
| Melt Temperature | Standard | Value | Measure Units |
| Suggested melt temperature | --- | 430 ÷ 465 | °F |
| Mould Temperature | Standard | Value | Measure Units |
| Suggested mould temperature | --- | 160 ÷ 195 | °F |
Storage
PAY ATTENTION! Material is prone to absorb moisture.
Drying conditions (hot air dessiccator)
Predrying needed. At least 2 hours at 175 ÷ 195°F
Injection speed
Injection speed: medium. Setting an injection profile should improve moulding.
Hot runners
Usage of hot runner: possible